• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Disclosed are a polishing pad conditioning disk and a polishing pad conditioner for use in a chemical mechanical polishing apparatus for planarizing a wafer. The disk for conditioning pad of the present invention includes a crimping part in which ore particles are molded on the lower surface of the metal plate, and a brush part installed around the outer edge of the crimping part and attached to a brush at the bottom thereof. In addition, the polishing pad conditioner of the present invention includes a polishing pad and a polishing pad conditioner using a polishing pad, wherein the polishing pad conditioning disk comprises a crimping part in which ore particles are molded on a lower surface of a metal plate. It is installed around the outer edge of the part and has a brush attached to the lower end, the pressing portion is directly connected to the lower end of the rotary shaft connected to the motor shaft, the brush portion is connected to the gear box installed on the rotary shaft and the pressing portion and the brush portion It is characterized by rotating separately.
    公开号:KR19990031565A
    申请号:KR1019970052346
    申请日:1997-10-13
    公开日:1999-05-06
    发明作者:김현수
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Polishing Pad Conditioning Disc and Polishing Pad Conditioner
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly, to a disk for polishing pad conditioning and a polishing pad conditioner capable of maintaining a constant surface state of a polishing pad used in a chemical mechanical polishing apparatus.
    In recent years, semiconductor devices have been highly integrated and their structures have been multilayered. As a result, a step occurs depending on the pattern between each layer, which affects the focus margin during the photographing process for patterning subsequent layers. Therefore, planarization of the interlayer film is required. One of the planarization techniques, the chemical mechanical polishing method, is suitable for the trend of large-size wafers because the planarization rate is excellent not only for local planarization but also for planarization of a large area.
    In the chemical mechanical polishing method, the rotating polishing pad and the wafer are brought into contact with each other at a predetermined pressure to polish the wafer by mechanical friction, and the polishing by the chemical component of the slurry supplied onto the polishing pad during polishing is performed. It proceeds with mechanical polishing. In such a chemical mechanical polishing method, the surface state of the polishing pad is an important variable which greatly affects the uniform planarization of the wafer. However, when the wafer is polished using the polishing pad, the surface of the polishing pad gradually becomes unsuitable to be polished in an optimized state for initial polishing due to compression and abrasion.
    Conventionally, in order to solve such a problem, the surface state of the polishing pad is kept constant by using the polishing pad conditioner as shown in FIG. 1, and the surface state of the polishing pad is kept constant by using the polishing pad conditioner hereinafter. The job of doing this is called conditioning.
    The conventional polishing pad conditioner has a polishing pad 14 installed on the rotatable surface plate 13. On the side facing the polishing pad 14, a conditioning disk 10 for conditioning the polishing pad 14 is located. The conditioning disk 10 is connected to the conditioning disk holder 16 supported by the arm 17 and the rotating shaft 15, which is attached to a carrier 12 installed at one end of the rotating shaft 15. Inside the conditioning disc holder 16 is a motor (not shown) for driving the rotating shaft,
    FIG. 2 is a plan view of a diamond disk, which is a type of the conventional polishing pad conditioning disk of FIG. 1, and as shown, generally, the diamond disk 20 is of the same hardness as the diamond particles 24 on a metal plate such as nickel. Is made by molding large ore particles. At this time, as the diamond particles 24, artificial diamond particles are mainly used in consideration of the production cost of the semiconductor device.
    The operation of the conventional polishing pad conditioner for conditioning the polishing pad using the diamond disk 20 will now be described with reference to FIG. 1.
    First, when a motor (not shown) installed in the conditioning disk holder 16 is driven, the conditioning disk 10 attached to the carrier 12 installed at one end of the rotation shaft 15 rotates. On the other hand, when the surface plate 13 rotates, the polishing pad 14 provided on the surface plate 13 also rotates together. When the rotating conditioning disk 10 is moved over the surface of the rotating polishing pad 14 with a suitable pressure, the surface of the polishing pad 14 is controlled by the conditioning disk 10, i.e., the diamond disk 20 of FIG. The surface of the polishing pad 14 deformed by polishing of the wafer by the mechanical friction with the artificial diamond particles 24 molded on the back) is returned to the state optimized for initial polishing.
    On the other hand, as the polishing of the wafer proceeds, the polishing pad 14 has slurry particles in the fine holes formed on the surface thereof, which adversely affects the polishing result of the wafer. The diamond disk 20 does not have a great effect in removing such slurry particles, and a nylon brush (not shown) is used instead. However, nylon brushes are effective at removing slurry particles but are not effective at restoring the pressed surface of the polishing pad.
    The present invention has been made to solve the above problems, to provide a polishing pad conditioning disk and polishing pad conditioner that can maintain the surface state of the polishing pad used in the chemical mechanical polishing apparatus optimized for polishing. The purpose is.
    1 is a cross-sectional view of a polishing pad conditioner for optimizing the surface state of a polishing pad used in a conventional chemical mechanical polishing apparatus.
    FIG. 2 is a plan view of a diamond disk, which is a type of the conventional polishing pad conditioning disk of FIG.
    3 and 4 are a plan view and a cross-sectional view of the polishing pad conditioning disk of the present invention, respectively.
    FIG. 5 is a conceptual diagram illustrating the use of the polishing pad conditioning disk of the present invention in FIG. 4 attached to a polishing pad conditioner. FIG.
    6 is a plan view of the gearbox of FIG.
    <Description of Symbols for Main Parts of Drawings>
    10: conditioning disk 13: table
    14: polishing pad 30: crimping portion
    36: Brush part 38: Brush
    54: gearbox 62, 64: gear
    The disk for polishing pad conditioning of the present invention for achieving the above object is provided with a crimping portion formed by molding the ore particles on a metal plate, and a brush portion attached to the outer edge of the crimping portion and attached to a brush at the bottom thereof.
    The metal plate of the crimping portion is characterized in that the nickel plate.
    The ore particles of the pressing portion are characterized in that the diamond particles.
    The brush attached to the lower end of the brush portion is characterized in that the detachable from the pressing portion in order to vary the length, thickness or material of the brush according to the type of the polishing pad.
    On the other hand, the polishing pad conditioner of the present invention comprises a polishing pad conditioner comprising a polishing pad and a polishing pad conditioning disk for conditioning the polishing pad, wherein the polishing pad conditioning disk is formed by molding ore particles on a metal plate. It is provided around the outer edge of the crimping portion and the crimping portion and has a brush attached to the bottom, the crimping portion is directly connected to the lower end of the rotary shaft connected to the motor shaft and the brush portion is connected to the gear box installed on the rotary shaft and the It is characterized in that the rotational speed of the portion and the rotational speed of the brush portion can be different.
    Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
    3 and 4 are a plan view and a cross-sectional view, respectively, of the conditioning disk of the present invention.
    The conditioning disk of the present invention has a crimping portion 30 and a brush portion 36 as shown. The crimping portion 30 has the same or similar to that of the conventional diamond disk 20 of FIG. 2, and is molded with ore particles having a high hardness such as diamond particles on one surface of a metal plate such as nickel, and has a rotation axis in FIG. The hole for attaching to (15) is formed. Brush portion 36 is attached to the outer edge of the crimping portion 30, the outer edge of the crimping portion 30 and the inner edge of the brush portion 36 is suitable to each other to rotate separately from the crimping portion 30 Can be spaced apart. Brush 38 is attached to the lower end of the brush portion 36, the material of the brush is suitable nylon.
    FIG. 5 is a conceptual diagram illustrating the use of the conditioning disk of the present invention of FIG. 4 attached to a polishing pad conditioner. FIG.
    The polishing pad conditioner of the present invention has a surface plate (not shown) and a polishing pad (not shown) disposed on the surface plate as in FIG. 1, and the surface plate and the polishing pad have a structure and a function of the surface plate 13 of FIG. 1. And since it is the same as or similar to the polishing pad 14, they are omitted in FIG. 5 for convenience and description thereof is also omitted.
    The conditioning disk of the invention shown in FIG. 3 or 4 with a crimping portion 30 and a brush portion 36 and a brush 38 attached to the lower end of the brush portion 36 is connected to the motor 50. It is installed at the lower end of the rotating shaft 52. In order to change the rotational speed of the crimping unit 30 and the brush unit 36, the crimping unit 30 is directly installed at the lower end of the rotating shaft 52, and the brush unit 36 is a gearbox installed at the rotating shaft 52 ( 54). On the other hand, the brush 38 attached to the lower end of the brush portion 36 is preferably removable.
    6 is a plan view of the gearbox of FIG.
    The illustrated gearbox 54 is connected to the rotary shaft 52 through a hole formed at its center and having a tooth formed at an outer edge thereof, so that the gearbox 54 is rotated in accordance with the driving of the motor and on the outside of the first gear. A second gear 63 is provided. The second gear 63 has teeth formed at an inner edge thereof, and the first gear 62 and the second gear 36 mesh with the plurality of gears 64a, 64b, and 64c. 6, the number of the plurality of gears 64a, 64b, 64c is shown as three, but the number of the plurality of gears 64a, 64b, 64c is not necessarily limited to three, for example two, Four or five.
    The operation of the polishing pad conditioner according to the present invention configured as described above will be described with reference to FIGS. 1 and 5.
    When the motor 50 is driven, the crimping portion 30 of the conditioning disk installed on one end of the rotating shaft 52 connected to the shaft of the motor 50 rotates. Meanwhile, the brush part 36 connected to the gear box 54 installed on the rotation shaft 52 also rotates, and the rotation speed is changed according to the gear ratio of the first gear 62 and the second gear 36 in the gear box 54. Can be adjusted. When the brush part 36 rotates, the brush 38 attached to the lower end of the brush part 36 also rotates together with the brush part 36.
    On the other hand, as shown in Figure 1, the polishing pad 14 installed on the surface plate 13 is rotated together as the surface plate 13 rotates. When the polishing pad 14 rotating in this manner is moved while pressing the pressing portion 30 and the brush portion 36 of the conditioning disk of the present invention at an appropriate pressure, the polishing pad 14 is moved to the pressing portion 30. The surface pressed by the artificial diamond particles (24 of FIG. 2) molded on the nickel plate is restored to its original state, and fine holes formed on the surface of the polishing pad 14 by the sole 38 attached to the bottom of the brush part 36. The slurried slurry is removed. At this time, by changing the material or thickness of the sole 38, or by adjusting the length of the sole 38, it is possible to more effectively remove the slurry in accordance with the type of the polishing pad (14).
    Therefore, the polishing pad conditioner of the present invention and the conditioning disk used therein can restore the pressed surface of the polishing pad to its original state and at the same time remove the slurry in the fine pores formed on the surface of the polishing pad, thereby providing a surface state of the polishing pad. By maintaining the constant, it is possible to effectively polish the wafer by the chemical mechanical polishing method.
    Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made within the spirit and scope of the present invention.
    As described above, the polishing pad conditioning disk and conditioner according to the present invention can restore the pressed surface of the polishing pad to its original state and at the same time remove the slurry in the fine holes formed on the surface of the polishing pad. By keeping the surface optimal for polishing the wafer, it is possible to effectively polish the wafer by a chemical mechanical polishing method.
    权利要求:
    Claims (10)
    [1" claim-type="Currently amended] A pressing part in which the ore particles are molded on the lower surface of the metal plate;
    Polishing pad conditioning disk is provided around the outer edge of the crimping portion having a brush attached to the lower end.
    [2" claim-type="Currently amended] The method of claim 1,
    And the metal flat plate of the crimping unit is a nickel flat plate.
    [3" claim-type="Currently amended] The method of claim 1,
    The ore particle of the crimping portion is a polishing pad conditioning disk, characterized in that the diamond particles.
    [4" claim-type="Currently amended] The method of claim 1,
    And an outer edge of the crimping portion and an inner edge of the brush portion spaced apart from each other by a predetermined distance from each other.
    [5" claim-type="Currently amended] The method of claim 1,
    The brush attached to the lower end of the brush portion is a polishing pad conditioning disk, characterized in that detachable.
    [6" claim-type="Currently amended] A polishing pad conditioner for conditioning a polishing pad using a polishing pad conditioning disk,
    The polishing pad conditioning disk is provided around the outer surface of the pressing portion molded with the ore particles molded on the lower surface of the metal plate, and the brush portion attached to the brush at the bottom,
    And the pressing part is directly connected to a lower end of a rotating shaft connected to a motor shaft, and the brush part is connected to a gear box installed on the rotating shaft so that the pressing part and the brush part are separated from each other and rotated.
    [7" claim-type="Currently amended] The method of claim 6,
    And the metal flat plate of the crimping unit is a nickel flat plate.
    [8" claim-type="Currently amended] The method according to claim 6,
    The ore particle of the crimping portion is a polishing pad conditioning disk, characterized in that the diamond particles.
    [9" claim-type="Currently amended] The method of claim 6,
    And an outer edge of the crimping portion and an inner edge of the brush portion spaced apart from each other by a predetermined distance from each other.
    [10" claim-type="Currently amended] The method of claim 6,
    The brush attached to the lower end of the brush portion is a polishing pad conditioning disk, characterized in that detachable.
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    同族专利:
    公开号 | 公开日
    KR100492987B1|2005-09-08|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-10-13|Application filed by 윤종용, 삼성전자 주식회사
    1997-10-13|Priority to KR1019970052346A
    1999-05-06|Publication of KR19990031565A
    2005-09-08|Application granted
    2005-09-08|Publication of KR100492987B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970052346A|KR100492987B1|1997-10-13|1997-10-13|A pad conditioner|
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